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XQ18V04VQ44N
- Part Number: XQ18V04VQ44N
- Categories:
- Manufacturer: Xilinx
- MOQ: 1PCS
- In Stock: 16623
- Datasheet:
- Description: IC CONFIG PROM 4MBIT 44TQFP
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- Delivery Method: UPS/DHL/FEDEX/EMS
Reference Price (In US Dollars)
- 1 Pcs$95.812
- 10 Pcs$91.249
- 100 Pcs$86.904
- 1000 Pcs$85.2
- 10000 Pcs$85.2
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XQ18V04VQ44N details
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Datasheets
XQ18V04VQ44N Specifications
| Manufacturer | Xilinx |
| Memory Size | 4MB |
| Mounting Type | Surface Mount |
| Package / Case | 44-TQFP |
| Product Status | Obsolete |
| Voltage - Supply | 3V ~ 3.6V |
| Programmable Type | In System Programmable |
| Operating Temperature | -55°C ~ 125°C |
| Supplier Device Package | 44-VQFP (10x10) |
XQ18V04VQ44N FPGAs Overview
Xilinx introduces the QPro™ XQ18V04VQ44N Military Grade 4Mbit in-system programmable configuration Flash PROM. The XQ18V04VQ44N is a 3.3V rewritable PROM that provides a reliable non-volatile method for storing large Xilinx FPGA configuration bitstreams used in systems that require operation over the full military temperature range.
When the FPGA is in Master Serial mode, it generates a configuration clock that drives the PROM. A short access time after the rising CCLK, data is available on the PROM DATA (D0) pin that is connected to the FPGA DIN pin. The FPGA generates the appropriate number of clock pulses to complete the configuration.
When the FPGA is in Slave Serial mode, the PROM and the FPGA are clocked by an external clock. When the FPGA is in SelectMAP mode (Slave), an external oscillator will generate the configuration clock that drives the PROM and the FPGA. After the rising CCLK edge, data is available on the PROMs DATA (D0-D7) pins. The data will be clocked into the FPGA on the following rising edge of the CCLK.
Multiple devices can be cascaded by using the CEO output to drive the CE input of the following device. The clock inputs and the DATA outputs of all PROMs in this chain are interconnected. The XQ18V04VQ44N is compatible and can be cascaded with other configuration PROMs such as the XQR1701L and XQR17V16 one-time programmable configuration PROMs.
Features
• Operating Temperature Range: –55°C to +125° C
• Low-power advanced CMOS FLASH process memory cells immune to static single event upset
• In-system programmable 3.3V PROMs for configuration of Xilinx FPGAs
- Endurance of 20,000 program/erase cycles
• IEEE Std 1149.1 boundary-scan (JTAG) support
• Cascadable for storing longer or multiple bitstreams
• Dual configuration modes
- Serial Slow/Fast configuration (up to 20 MHz)
- Parallel (up to 160 Mbps at 20 MHz)
• 5V tolerant I/O pins accept 5V, 3.3V, and 2.5V signals
• 3.3V or 2.5V output capability
• Available in plastic VQ44 packaging only
• Design support using the Xilinx Alliance Series™ and Xilinx Foundation Series™ software packages
• JTAG command initiation of standard FPGA configuration
Features
• Operating Temperature Range: –55°C to +125° C
• Low-power advanced CMOS FLASH process memory cells immune to static single event upset
• In-system programmable 3.3V PROMs for configuration of Xilinx FPGAs
- Endurance of 20,000 program/erase cycles
• IEEE Std 1149.1 boundary-scan (JTAG) support
• Cascadable for storing longer or multiple bitstreams
• Dual configuration modes
- Serial Slow/Fast configuration (up to 20 MHz)
- Parallel (up to 160 Mbps at 20 MHz)
• 5V tolerant I/O pins accept 5V, 3.3V, and 2.5V signals
• 3.3V or 2.5V output capability
• Available in plastic VQ44 packaging only
• Design support using the Xilinx Alliance Series and Xilinx Foundation Series software packages
• JTAG command initiation of standard FPGA configuration
• Low-power advanced CMOS FLASH process memory cells immune to static single event upset
• In-system programmable 3.3V PROMs for configuration of Xilinx FPGAs
- Endurance of 20,000 program/erase cycles
• IEEE Std 1149.1 boundary-scan (JTAG) support
• Cascadable for storing longer or multiple bitstreams
• Dual configuration modes
- Serial Slow/Fast configuration (up to 20 MHz)
- Parallel (up to 160 Mbps at 20 MHz)
• 5V tolerant I/O pins accept 5V, 3.3V, and 2.5V signals
• 3.3V or 2.5V output capability
• Available in plastic VQ44 packaging only
• Design support using the Xilinx Alliance Series and Xilinx Foundation Series software packages
• JTAG command initiation of standard FPGA configuration
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XQ18V04VQ44N Packaging
step1: Inspect Products
step2: Vacuum Packaging
step3: Anti-Static Bag
step4: Individual Packing
step5: Packing Box
step6：Shipping Tag
- Before shipping, we will inspect the parts to ensure it in good condition and check that the parts are brand-new and original with the datasheet. And then, all the products will be packed in an anti-static bag.
- After ensuring that there are no issues with any of the goods after packing, we will wrap them carefully and send them by international express. It demonstrates exceptional seal integrity, outstanding tear and puncture resistance, and both.
Manufacturer Overview
Xilinx is a leading provider of programmable logic devices and associated technologies. As a top producer of programmable FPGAs, SoCs, MPSoCs, and 3D ICs, Xilinx has expanded quickly. Software defined and hardware optimized applications are supported by Xilinx, advancing the fields of cloud computing, SDN/NFV, video/vision, industrial IoT, and 5G wireless.
One of Xilinx's key innovations is the development of the Xilinx Vivado Design Suite, a comprehensive software toolchain used for designing and programming their FPGAs and SoCs. This suite provides developers with the necessary tools to create, simulate, and implement their designs on Xilinx devices.
In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a major player in the semiconductor industry. This acquisition has enabled AMD to enhance its product portfolio and expand its offerings into the rapidly growing FPGA market.
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- A temperature transducer is a sensor that can sense temperature and convert it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument, and there are many varieties. After entering the 21st century, temperature sensors are rapidly developing towards high-tech directions such as high precision, multi-function, bus standardization, high reliability and safety, development of virtual sensors and network sensors, and development of single-chip temperature measurement systems. The bus technology of the temperature sensor has also been standardized, and it can be used as a slave to communicate with the host through a dedicated bus interface. According to the measurement method, it can be divided into two categories: a contact type and a non-contact type. According to the characteristics of sensor materials and electronic components, it can be divided into two types: thermal resistance and thermocouple. 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Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. 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There are two types of changes in resistance positive temperature coefficient Increased temperature = increased resistance A decrease in temperature = a decrease in resistance negative temperature coefficient Increased temperature = decreased resistance Decrease in temperature = increase in resistance Thermocouple Sensing A thermocouple consists of two metal wires of different materials welded together at the ends. Then measure the ambient temperature of the non-heating part, and the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities also vary. The sensitivity of the thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1 °C. For most thermocouples supported by metallic materials, this value is between 5 and 40 microvolts/°C. Since the sensitivity of the thermocouple temperature sensor has nothing to do with the thickness of the material, it can also be made into a temperature sensor with very thin materials. Also due to the good ductility of the metal material used to make thermocouples, this tiny temperature-measuring element has a very high response speed and can measure rapidly changing processes. Selection method If you want to make reliable temperature measurements, you first need to choose the correct temperature instrument, that is, the temperature sensor. Among them, thermocouples, thermistors, platinum resistance thermometers (RTDs), and temperature ICs are the most commonly used temperature sensors in testing. The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. Since the temperature is a nonlinear relationship between voltage and temperature, it is necessary to make a second measurement for the reference temperature (Tref), and use the test equipment software or hardware to process the voltage-temperature conversion inside the instrument, to Finally the thermocouple temperature (Tx), is obtained. Both Agilent34970A and 34980A data collectors have built-in measurement computing capabilities. In short, thermocouples are the simplest and most versatile temperature sensors, but thermocouples are not suitable for high-precision measurements and applications. Thermistors are made of semiconductor materials, and most of them have a negative temperature coefficient, that is, the resistance value decreases with the increase in temperature. Temperature changes will cause large resistance changes, so it is the most sensitive temperature sensor. However, the linearity of the thermistor is extremely poor and has a lot to do with the production process. 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