Manufacturer | Xilinx |
Speed | 500MHz, 1.2GHz |
RAM Size | 256kB |
Flash Size | - |
Peripherals | DMA, WDT |
Architecture | MCU, FPGA |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Package / Case | 1517-BBGA, FCBGA |
Product Status | Active |
Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
Operating Temperature | 0°C ~ 100°C (TJ) |
Supplier Device Package | 1517-FCBGA (40x40) |
The XCZU47DR-1FFVG1517E of Zynq UltraScale+ RFSoC family integrates key subsystems for multiband, multi-mode cellular radios and cable infrastructure (DOCSIS) into an SoC platform that contains a feature-rich 64-bit quad-core Arm Cortex-A53 and dual-core Arm Cortex-R5 based processing system.
Combining the processing system with UltraScale architecture programmable logic and RF-ADCs, RF-DACs, and soft-decision FECs, the Zynq UltraScale+ RFSoC family is capable of implementing a complete software-defined radio including direct RF sampling data converters, enabling CPRI and gigabit Ethernet-to-RF on a single, highly programmable SoC.
The XCZU47DR-1FFVG1517E of Three generations of Zynq UltraScale+ RFSoCs integrate up to 16 channels of RF-ADCs and RF-DACs, all with excellent noise spectral density. The RF data converters also include power efficient digital down converters (DDCs) and digital up converters (DUCs) that include programmable interpolation and decimation, NCO, and complex mixer. The DDCs and DUCs can also support dual-band operation. See Table 1 for key features and sample rates.
RF Data Converter Subsystem Overview
Most Zynq UltraScale+ RFSoCs include an RF data converter subsystem, which contains multiple radio
frequency analog to digital converters (RF-ADCs) and multiple radio frequency digital to analog
converters (RF-DACs). The high-precision, high-speed, power efficient RF-ADCs and RF-DACs can be
individually configured for real data or can be configured in pairs for real and imaginary I/Q data.
Soft Decision Forward Error Correction (SD-FEC) Overview
Some Zynq UltraScale+ RFSoCs include highly flexible soft-decision FEC blocks for decoding and encoding
data as a means to control errors in data transmission over unreliable or noisy communication channels.
The SD-FEC blocks support low-density parity check (LDPC) decode/encode and Turbo decode for use in
5G wireless, backhaul, DOCSIS, and LTE applications.
Processing System Overview
Zynq UltraScale+ RFSoCs feature a quad-core Arm Cortex-A53 (APU) with a dual-core Arm Cortex-R5
(RPU) processing system (PS).
To support the processors' functionality, a number of peripherals with dedicated functions are included in
the PS. For interfacing to external memories for data or configuration storage, the PS includes a
multi-protocol dynamic memory controller, a DMA controller, a NAND controller, an SD/eMMC controller
and a Quad SPI controller. In addition to interfacing to external memories, the APU also includes a Level-1
(L1) and Level-2 (L2) cache hierarchy; the RPU includes an L1 cache and Tightly Coupled memory
subsystem. Each has access to a 256KB on-chip memory.
For high-speed interfacing, the PS includes 4 channels of transmit (TX) and receive (RX) pairs of
transceivers, called PS-GTR transceivers, supporting data rates of up to 6.0Gb/s. These transceivers can interface to the high-speed peripheral blocks that support PCIe at 5.0GT/s (Gen2) as a root complex or
Endpoint in x1, x2, or x4 configurations; Serial-ATA (SATA) at 1.5Gb/s, 3.0Gb/s, or 6.0Gb/s data rates; and
up to two lanes of DisplayPort at 1.62Gb/s, 2.7Gb/s, or 5.4Gb/s data rates. The PS-GTR transceivers can
also interface to components over USB 3.0 and Serial Gigabit Media Independent Interface (SGMII).
For general connectivity, the PS includes: a pair of USB 2.0 controllers, which can be configured as host,
device, or On-The-Go (OTG); an I2C controller; a UART; and a CAN2.0B controller that conforms to
ISO11898-1. There are also four triple speed Ethernet MACs and 128 bits of GPIO, of which 78 bits are
available through the MIO and 96 through the EMIO.
High-bandwidth connectivity based on the Arm AMBA AXI4 protocol connects the processing units with
the peripherals and provides interface between the PS and the programmable logic (PL).
I/O, Transceiver, PCIe, 100G Ethernet, and 150G Interlaken
Data is transported on and off chip through a combination of the high-performance parallel SelectIO
interface and high-speed serial transceiver connectivity. I/O blocks provide support for cutting-edge
memory interface and network protocols through flexible I/O standard and voltage support. The serial
transceivers in the UltraScale architecture-based devices transfer data up to 28.21Gb/s, enabling 25G+
backplane designs with dramatically lower power per bit than previous generation transceivers. All
transceivers, except the PS-GTR, support the required data rates for 8.0GT/s (Gen3) and 16.0GT/s (Gen4)
for PCIe. The integrated blocks for PCIe can be configured as either Endpoint or Root Port, supporting a
variety of link widths and speeds depending on the targeted device speed grade and package. Integrated
blocks for 150Gb/s Interlaken and 100Gb/s Ethernet (100G MAC/PCS) extend the capabilities of
UltraScale devices, enabling simple, reliable support for Nx100G switch and bridge applications.
Clocks and Memory Interfaces
Zynq UltraScale+ RFSoCs contain powerful clock management circuitry, including clock synthesis,
buffering, and routing components that together provide a highly capable framework to meet design
requirements. The clock network allows for extremely flexible distribution of clocks to minimize the skew,
power consumption, and delay associated with clock signals. The clock management technology is tightly
integrated with dedicated memory interface circuitry to enable support for high-performance external
memories, including DDR4. In addition to parallel memory interfaces, Zynq UltraScale+ RFSoCs support
serial memories, such as hybrid memory cube (HMC).
Routing, Logic, Storage, and Signal Processing
Configurable logic blocks (CLBs) containing 6-input look-up tables (LUTs) and flip-flops, DSP slices with
27x18 multipliers, 36Kb block RAMs with built-in FIFO and ECC support, and 4Kx72 UltraRAM blocks are all
connected with an abundance of high-performance, low-latency interconnect. In addition to logical
functions, the CLB provides shift register, multiplexer, and carry logic functionality as well as the ability to
configure the LUTs as distributed memory to complement the highly capable and configurable block
RAMs. The DSP slice, with its 96-bit-wide XOR functionality, 27-bit pre-adder, and 30-bit A input, performs
numerous independent functions including multiply accumulate, multiply add, and pattern detect.
Configuration, Encryption, and System Monitoring
Zynq UltraScale+ RFSoCs are booted via the configuration security unit (CSU), which supports secure boot
via the 256-bit AES-GCM and SHA/384 blocks. The cryptographic engines in the CSU can be used in the
RFSoC after boot for user encryption. The System Monitor enables the monitoring of the physical
environment via on-chip temperature and supply sensors and can also monitor up to 17 external analog
inputs.
Xilinx is a leading provider of programmable logic devices and associated technologies. As a top producer of programmable FPGAs, SoCs, MPSoCs, and 3D ICs, Xilinx has expanded quickly. Software defined and hardware optimized applications are supported by Xilinx, advancing the fields of cloud computing, SDN/NFV, video/vision, industrial IoT, and 5G wireless.
One of Xilinx's key innovations is the development of the Xilinx Vivado Design Suite, a comprehensive software toolchain used for designing and programming their FPGAs and SoCs. This suite provides developers with the necessary tools to create, simulate, and implement their designs on Xilinx devices.
In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a major player in the semiconductor industry. This acquisition has enabled AMD to enhance its product portfolio and expand its offerings into the rapidly growing FPGA market.