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XCR3256XL-12TQ144C
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XCR3256XL-12TQ144C

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  • 1 Pcs
    $11.844
  • 10 Pcs
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  • 100 Pcs
    $10.743
  • 1000 Pcs
    $10.532
  • 10000 Pcs
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Specifications
XCR3256XL-12TQ144C details
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XCR3256XL-12TQ144C Specifications
Manufacturer Xilinx
Mounting Type Surface Mount
Number of I/O 120
Package / Case 144-LQFP
Product Status Active
Number of Gates 6000
Programmable Type In System Programmable (min 1K program/erase cycles)
Number of Macrocells 256
Delay Time tpd(1) Max 10.8 ns
Operating Temperature 0°C ~ 70°C (TA)
Supplier Device Package 144-TQFP (20x20)
Voltage Supply - Internal 3V ~ 3.6V
Number of Logic Elements/Blocks 16

XCR3256XL-12TQ144C FPGAs Overview

Description

The CoolRunner XPLA3 (eXtended Programmable Logic Array) family of CPLDs is targeted for low power systems that include portable, handheld, and power sensitive applications. Each member of the CoolRunner XPLA3 family includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the CoolRunner XPLA3 family offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for "turbo bits" or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. CoolRunner devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.

The CoolRunner XPLA3 family employs a full PLA structure for logic allocation within a function block. The PLA provides maximum flexibility and logic density, with superior pin locking capability, while maintaining deterministic timing.

CoolRunner XPLA3 CPLDs are supported by Xilinx® WebPACK™ software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms. 

The CoolRunner XPLA3 family features also include the industry-standard, IEEE 1149.1, JTAG interface through which boundary-scan testing, In-System Programming (ISP), and reprogramming of the device can occur. The CoolRunner XPLA3 CPLD is electrically reprogrammable using industry standard device programmers. 

Features

• Fast Zero Power (FZP) design technique provides ultra-low power and very high speed
  - Typical Standby Current of 17 to 18 μA at 25°C
• Innovative CoolRunner™ XPLA3 architecture combines high speed with extreme flexibility
• Based on industry's first TotalCMOS PLD — both CMOS design and process technologies
• Advanced 0.35μ five layer metal EEPROM process
  - 1,000 erase/program cycles guaranteed
  - 20 years data retention guaranteed
• 3V, In-System Programmable (ISP) using JTAG IEEE 1149.1 interface
  - Full Boundary-Scan Test (IEEE 1149.1)
  - Fast programming times
• Support for complex asynchronous clocking
  - 16 product term clocks and four local control term clocks per function block
  - Four global clocks and one universal control term clock per device
• Excellent pin retention during design changes

• Available in commercial grade and extended voltage(2.7V to 3.6V) industrial grade
• 5V tolerant I/O pins
• Input register setup time of 2.5 ns
• Single pass logic expandable to 48 product terms
• High-speed pin-to-pin delays of 5.0 ns
• Slew rate control per output
• 100% routable
• Security bit prevents unauthorized access
• Supports hot-plugging capability
• Design entry/verification using Xilinx or industry standard CAE tools
• Innovative Control Term structure provides:
  - Asynchronous macrocell clocking
  - Asynchronous macrocell register preset/reset
  - Clock enable control per macrocell
• Four output enable controls per function block
• Foldback NAND for synthesis optimization
• Universal 3-state which facilitates "bed of nails" testing
• Available in Chip-scale BGA, Fineline BGA, and QFP packages. Pb-free available for most package types. 


The Xilinx Programmable logic array series XCR3256XL-12TQ144C is 256 Macrocell CPLD, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at bitfoic.com, and you can also search for other FPGAs products.

Features

  • Low power 3.3V 256 macrocell CPLD
  • 7.0 ns pin-to-pin logic delays
  • System frequencies up to 154 MHz
  • 256 macrocells with 6,000 usable gates
  • Available in small footprint packages
    • 144-pin TQFP (120 user I/O pins)
    • 208-pin PQFP (164 user I/O)
    • 256-ball FBGA (164 user I/O)
    • 280-ball CS BGA (164 user I/O)
  • Optimized for 3.3V systems
    • Ultra low power operation
    • Typical Standby Current of 18 μA at 25° C
    • 5V tolerant I/O pins with 3.3V core supply
    • Advanced 0.35 micron five layer metal EEPROM process
    • Fast Zero Power (FZP) CMOS design technology
    • 3.3V PCI electrical specification compatible outputs (no internal clamp diode on any input or I/O)
  • Advanced system features
    • In-system programming
    • Input registers
    • Predictable timing model
    • Up to 23 clocks available per function block
    • Excellent pin retention during design changes
    • Full IEEE Standard 1149.1 boundary-scan (JTAG)
    • Four global clocks
    • Eight product term control terms per function block
  • Fast ISP programming times
  • Port Enable pin for additional I/O
  • 2.7V to 3.6V supply voltage at industrial grade voltage range
  • Programmable slew rate control per output
  • Security bit prevents unauthorized access
  • Refer to the CoolRunner XPLA3 family data sheet (DS012) for architecture description
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Manufacturer Overview
Xilinx

Xilinx is a leading provider of programmable logic devices and associated technologies. As a top producer of programmable FPGAs, SoCs, MPSoCs, and 3D ICs, Xilinx has expanded quickly. Software defined and hardware optimized applications are supported by Xilinx, advancing the fields of cloud computing, SDN/NFV, video/vision, industrial IoT, and 5G wireless.

One of Xilinx's key innovations is the development of the Xilinx Vivado Design Suite, a comprehensive software toolchain used for designing and programming their FPGAs and SoCs. This suite provides developers with the necessary tools to create, simulate, and implement their designs on Xilinx devices.

In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a major player in the semiconductor industry. This acquisition has enabled AMD to enhance its product portfolio and expand its offerings into the rapidly growing FPGA market.

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A temperature transducer is a sensor that can sense temperature and convert it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument, and there are many varieties. After entering the 21st century, temperature sensors are rapidly developing towards high-tech directions such as high precision, multi-function, bus standardization, high reliability and safety, development of virtual sensors and network sensors, and development of single-chip temperature measurement systems. The bus technology of the temperature sensor has also been standardized, and it can be used as a slave to communicate with the host through a dedicated bus interface. According to the measurement method, it can be divided into two categories: a contact type and a non-contact type. According to the characteristics of sensor materials and electronic components, it can be divided into two types: thermal resistance and thermocouple. Main Category The detection part of the contact temperature sensor is in good contact with the measured object, also known as a thermometer. The thermometer achieves heat balance through conduction or convection so that the indication value of the thermometer can directly represent the temperature of the measured object. Generally, the measurement accuracy is high. Within a certain temperature range, the thermometer can also measure the temperature distribution inside the object. However, large measurement errors will occur for moving bodies, small targets, or objects with small heat capacity. Commonly used thermometers include bimetallic thermometers, liquid-in-glass thermometers, pressure thermometers, resistance thermometers, thermistors, and thermocouples. They are widely used in industry, agriculture, commerce, and other sectors. People also often use these thermometers in daily life. 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Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. Only the temperature measured for a black body (an object that absorbs all radiation and does not reflect light) is the true temperature. If you want to measure the real temperature of the object, you must correct the surface emissivity of the material. However, the surface emissivity of materials depends not only on temperature and wavelength, but also on surface state, coating film, and microstructure, so it is difficult to measure accurately. In automatic production, it is often necessary to use radiation thermometry to measure or control the surface temperature of certain objects, such as the steel strip rolling temperature, roll temperature, forging temperature in metallurgy, and the temperature of various molten metals in smelting furnaces or crucibles. In these specific cases, the measurement of the emissivity of an object's surface is quite difficult. For automatic measurement and control of solid surface temperature, an additional reflector can be used to form a black body cavity together with the measured surface. The effect of additional radiation can increase the effective radiation and effective emissivity of the measured surface. Use the effective emissivity coefficient to correct the measured temperature through the instrument, and finally get the real temperature of the measured surface. The most typical additional mirror is hemispherical. The diffuse radiation on the measured surface near the center of the sphere can be reflected on the surface by the hemispherical mirror to form additional radiation, thereby increasing the effective emissivity coefficient. In the formula, ε is the surface emissivity of the material, and ρ is the reflectivity of the mirror. 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There are two types of changes in resistance positive temperature coefficient Increased temperature = increased resistance A decrease in temperature = a decrease in resistance negative temperature coefficient Increased temperature = decreased resistance Decrease in temperature = increase in resistance Thermocouple Sensing A thermocouple consists of two metal wires of different materials welded together at the ends. Then measure the ambient temperature of the non-heating part, and the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities also vary. The sensitivity of the thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1 °C. For most thermocouples supported by metallic materials, this value is between 5 and 40 microvolts/°C. Since the sensitivity of the thermocouple temperature sensor has nothing to do with the thickness of the material, it can also be made into a temperature sensor with very thin materials. Also due to the good ductility of the metal material used to make thermocouples, this tiny temperature-measuring element has a very high response speed and can measure rapidly changing processes. Selection method If you want to make reliable temperature measurements, you first need to choose the correct temperature instrument, that is, the temperature sensor. Among them, thermocouples, thermistors, platinum resistance thermometers (RTDs), and temperature ICs are the most commonly used temperature sensors in testing. The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. Since the temperature is a nonlinear relationship between voltage and temperature, it is necessary to make a second measurement for the reference temperature (Tref), and use the test equipment software or hardware to process the voltage-temperature conversion inside the instrument, to Finally the thermocouple temperature (Tx), is obtained. Both Agilent34970A and 34980A data collectors have built-in measurement computing capabilities. In short, thermocouples are the simplest and most versatile temperature sensors, but thermocouples are not suitable for high-precision measurements and applications. Thermistors are made of semiconductor materials, and most of them have a negative temperature coefficient, that is, the resistance value decreases with the increase in temperature. Temperature changes will cause large resistance changes, so it is the most sensitive temperature sensor. However, the linearity of the thermistor is extremely poor and has a lot to do with the production process. 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