Manufacturer | Xilinx® |
Series | Spartan®-7 |
Packaging | Tray |
Manufacturer | Xilinx® |
Mounting Type | Surface Mount |
Number of I/ O | 100 |
Package / Case | 225-LFBGA, CSPBGA |
Product Status | Active |
Total R A M Bits | 368640 |
Voltage - Supply | 0.92V ~ 0.98V |
Base Product Number | XC7S15 |
Operating Temperature | -40°C ~ 100°C (TJ) |
Supplier Device Package | 225-CSPBGA (13x13) |
Number of L A Bs/ C L Bs | 1000 |
Integrated Circuits (ICs) | Embedded - FPGAs (Field Programmable Gate Array) |
Number of Logic Elements/ Cells | 12800 |
Xilinx 7 XC7S15-L1CSGA225I FPGAs address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.
• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
• Quickly deploy embedded processing with MicroBlaze processor.
• Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.