Manufacturer | AMD |
Mounting Type | Surface Mount |
Number of I/O | 106 |
Package / Case | 238-LFBGA, CSPBGA |
Product Status | Active |
Total RAM Bits | 2764800 |
Number of Gates | - |
Voltage - Supply | 0.95V ~ 1.05V |
Number of LABs/CLBs | 4075 |
Operating Temperature | 0°C ~ 100°C (TJ) |
Supplier Device Package | 238-CSBGA (10x10) |
Number of Logic Elements/Cells | 52160 |
Xilinx 7 series XC7A50T-3CPG236E FPGAs families complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7A50T-3CPG236E FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.