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XC4044XL-1HQ240C
- Part Number: XC4044XL-1HQ240C
- Categories:
- Manufacturer: Xilinx
- MOQ: 1PCS
- In Stock: 6569
- Datasheet:
- Description: IC FPGA 193 I/O 240QFP
- Payment method: Paypal/Wire transfer/Stripe/ Visa/Mastercard/AMEX
- Delivery Method: Ship within 12 hours
Reference Price (In US Dollars)
- 1 Pcs$6.189
- 10 Pcs$5.895
- 100 Pcs$5.614
- 1000 Pcs$5.504
- 10000 Pcs$5.504
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Specifications
XC4044XL-1HQ240C details
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Datasheets
XC4044XL-1HQ240C Specifications
| Manufacturer | Xilinx |
| Mounting Type | Surface Mount |
| Number of I/O | 193 |
| Package / Case | 240-BFQFP Exposed Pad |
| Product Status | Obsolete |
| Total RAM Bits | 51200 |
| Number of Gates | 44000 |
| Voltage - Supply | 3V ~ 3.6V |
| Number of LABs/CLBs | 1600 |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 240-PQFP (32x32) |
| Number of Logic Elements/Cells | 3800 |
XC4044XL-1HQ240C FPGAs Overview
The XC4044XL-1HQ240C Field-Programmable Gate Array Family is engineered to
deliver low cost. Building on experiences gained with three previous successful
SRAM FPGA families, the XC4044XL-1HQ240C family brings a robust feature set to
programmable logic design. The VersaBlock logic module, the VersaRing I/O
interface, and a rich hierarchy of interconnect resources combine to enhance
design flexibility and reduce time-to-market. Complete support for the XC4044XL-1HQ240C family
is delivered through the familiar Xilinx software environment. The XC4044XL-1HQ240C family
is fully supported on popular workstation and PC platforms. Popular design
entry methods are fully supported, including ABEL, schematic capture, VHDL, and
Verilog HDL synthesis. Designers utilizing logic synthesis can use their
existing tools to design with the XC4044XL-1HQ240C devices.
Features
• Low-cost, register/latch rich, SRAM based reprogrammable architecture
- 0.5µm three-layer metal CMOS process technology
- 256 to 1936 logic cells (3,000 to 23,000 “gates”)
- Price competitive with Gate Arrays
• System Level Features
- System performance beyond 50 MHz
- 6 levels of interconnect hierarchy
- VersaRing I/O Interface for pin-locking
- Dedicated carry logic for high-speed arithmetic functions
- Cascade chain for wide input functions
- Built-in IEEE 1149.1 JTAG boundary scan test circuitry on all I/O pins
- Internal 3-state bussing capability
- Four dedicated low-skew clock or signal distribution nets
• Versatile I/O and Packaging
- Innovative VersaRing I/O interface provides a high logic cell to I/O ratio, with up to 244 I/O signals
- Programmable output slew-rate control maximizes performance and reduces noise
- Zero Flip-Flop hold time for input registers simplifies system timing
- Independent Output Enables for external bussing
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XC4044XL-1HQ240C Packaging
step1: Inspect Products
step2: Vacuum Packaging
step3: Anti-Static Bag
step4: Individual Packing
step5: Packing Box
step6：Shipping Tag
- Before shipping, we will inspect the parts to ensure it in good condition and check that the parts are brand-new and original with the datasheet. And then, all the products will be packed in an anti-static bag.
- After ensuring that there are no issues with any of the goods after packing, we will wrap them carefully and send them by international express. It demonstrates exceptional seal integrity, outstanding tear and puncture resistance, and both.
Manufacturer Overview
Xilinx is a leading provider of programmable logic devices and associated technologies. As a top producer of programmable FPGAs, SoCs, MPSoCs, and 3D ICs, Xilinx has expanded quickly. Software defined and hardware optimized applications are supported by Xilinx, advancing the fields of cloud computing, SDN/NFV, video/vision, industrial IoT, and 5G wireless.
One of Xilinx's key innovations is the development of the Xilinx Vivado Design Suite, a comprehensive software toolchain used for designing and programming their FPGAs and SoCs. This suite provides developers with the necessary tools to create, simulate, and implement their designs on Xilinx devices.
In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a major player in the semiconductor industry. This acquisition has enabled AMD to enhance its product portfolio and expand its offerings into the rapidly growing FPGA market.
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Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. 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There are two types of changes in resistance positive temperature coefficient Increased temperature = increased resistance A decrease in temperature = a decrease in resistance negative temperature coefficient Increased temperature = decreased resistance Decrease in temperature = increase in resistance Thermocouple Sensing A thermocouple consists of two metal wires of different materials welded together at the ends. Then measure the ambient temperature of the non-heating part, and the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities also vary. The sensitivity of the thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1 °C. 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The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. Since the temperature is a nonlinear relationship between voltage and temperature, it is necessary to make a second measurement for the reference temperature (Tref), and use the test equipment software or hardware to process the voltage-temperature conversion inside the instrument, to Finally the thermocouple temperature (Tx), is obtained. Both Agilent34970A and 34980A data collectors have built-in measurement computing capabilities. In short, thermocouples are the simplest and most versatile temperature sensors, but thermocouples are not suitable for high-precision measurements and applications. Thermistors are made of semiconductor materials, and most of them have a negative temperature coefficient, that is, the resistance value decreases with the increase in temperature. Temperature changes will cause large resistance changes, so it is the most sensitive temperature sensor. However, the linearity of the thermistor is extremely poor and has a lot to do with the production process. 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