Manufacturer | Xilinx |
Mounting Type | Surface Mount |
Number of I/O | 692 |
Package / Case | 1152-BBGA, FCBGA |
Product Status | Obsolete |
Total RAM Bits | 4276224 |
Number of Gates | - |
Voltage - Supply | 1.425V ~ 1.575V |
Number of LABs/CLBs | 5904 |
Operating Temperature | 0°C ~ 85°C (TJ) |
Supplier Device Package | 1152-FCBGA (35x35) |
Number of Logic Elements/Cells | 53136 |
The Virtex-II Pro and Virtex-II Pro X families contain platform FPGAs for designs that are based on IP cores and customized modules. The family incorporates multi-gigabit transceivers and PowerPC CPU blocks in Virtex-II Pro Series FPGA architecture. It empowers complete solutions for telecommunication, wireless, networking, video, and DSP applications.
The leading-edge 0.13 µm CMOS nine-layer copper process and Virtex-II Pro architecture are optimized for high performance designs in a wide range of densities. Combining a wide variety of flexible features and IP cores, the Virtex-II Pro family enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gate arrays.
Features
This section briefly describes Virtex-II Pro / Virtex-II Pro X features. For more details, refer to Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Functional Description.
RocketIO / RocketIO X MGT Cores
The RocketIO and RocketIO X Multi-Gigabit Transceivers are flexible parallel-to-serial and serial-to-parallel embedded transceiver cores used for high-bandwidth interconnection between buses, backplanes, or other subsystems. Multiple user instantiations in an FPGA are possible, providing up to 100 Gb/s (RocketIO) or 170 Gb/s (RocketIO X) of full-duplex raw data transfer. Each channel can be operated at a maximum data transfer rate of 3.125 Gb/s (RocketIO) or 6.25 Gb/s (RocketIO X). Each RocketIO or RocketIO X core implements the following technology:
• Serializer and deserializer (SERDES)
• Monolithic clock synthesis and clock recovery (CDR)
• 10 Gigabit Attachment Unit Interface (XAUI) Fibre Channel (3.1875 Gb/s XAUI), Infiniband, PCI Express, Aurora, SXI-5 (SFI-5,/SPI-5), and OC-48 compatibility(1)
• 8/16/32-bit (RocketIO) or 8/16/32/64-bit (RocketIO X) selectable FPGA interface
• 8B/10B (RocketIO) or 8B/10B and 64B/66B (RocketIO X) encoder and decoder with bypassing option on each channel
• Channel bonding support (two to twenty channels) - Elastic buffers for inter-chip deskewing and channel-to-channel alignment • Receiver clock recovery tolerance of up to 75 non-transitioning bits
• 50Ω (RocketIO X) or 50Ω /75Ω selectable (RocketIO) on-chip transmit and receive terminations
• Programmable comma detection and word alignment
• Rate matching via insertion/deletion characters
• Automatic lock-to-reference function
• Programmable pre-emphasis support
• Per-channel serial and parallel transmitter-to-receiver internal loopback modes
• Optional transmit and receive data inversion
• Cyclic Redundancy Check support (RocketIO only)
The Xilinx FPGAs series XC2VP50-7FFG1152C is FPGA Virtex-II Pro Family 53136 Cells 1350MHz 0.13um/90nm (CMOS) Technology 1.5V 1152Pin FC-BGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at bitfoic.com, and you can also search for other FPGAs products.High-Performance Platform FPGA Solution, Including
Up to twenty RocketIO or RocketIO X embedded Multi-Gigabit Transceivers (MGTs)
Up to two IBM PowerPC RISC processor blocks
Based on Virtex-II Platform FPGA Technology
Flexible logic resources
SRAM-based in-system configuration
Active Interconnect technology
SelectRAM+ memory hierarchy
Dedicated 18-bit x 18-bit multiplier blocks
High-performance clock management circuitry
SelectI/O-Ultra technology
XCITE Digitally Controlled Impedance (DCI) I/O
Xilinx is a leading provider of programmable logic devices and associated technologies. As a top producer of programmable FPGAs, SoCs, MPSoCs, and 3D ICs, Xilinx has expanded quickly. Software defined and hardware optimized applications are supported by Xilinx, advancing the fields of cloud computing, SDN/NFV, video/vision, industrial IoT, and 5G wireless.
One of Xilinx's key innovations is the development of the Xilinx Vivado Design Suite, a comprehensive software toolchain used for designing and programming their FPGAs and SoCs. This suite provides developers with the necessary tools to create, simulate, and implement their designs on Xilinx devices.
In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a major player in the semiconductor industry. This acquisition has enabled AMD to enhance its product portfolio and expand its offerings into the rapidly growing FPGA market.