Manufacturer | Xilinx |
Mounting Type | Surface Mount |
Number of I/O | 150 |
Package / Case | 324-LFBGA, CSPBGA |
Product Status | Active |
Total RAM Bits | 921600 |
Number of Gates | - |
Voltage - Supply | 0.95V ~ 1.05V |
Number of LABs/CLBs | 1300 |
Operating Temperature | -40°C ~ 100°C (TJ) |
Supplier Device Package | 324-CSPBGA (15x15) |
Number of Logic Elements/Cells | 16640 |
Xilinx XA7A15T-2CSG325I (Automotive) FPGAs are optimized for the lowest cost and power with small form-factor packaging for high-volume automotive applications. Designers can leverage more logic per watt compared to the Spartan-6 family.
Built on a state-of-the-art high-performance/low-power (HPL) 28 nm high-k metal gate (HKMG) process technology, XA XA7A15T-2CSG325I FPGAs redefine low-cost alternatives with more logic per watt. Unparalleled increase in system performance with 52 Gb/s I/O bandwidth, 100,000 logic cell capacity, 264 GMAC/s DSP, and flexible built-in DDR3 memory interfaces enable a new class of high-throughput, low-cost automotive applications. XA Artix-7 XA7A15T-2CSG325I FPGAs also offer many high-end features, such as integrated advanced Analog Mixed Signal (AMS) technology. Analog becomes the next level of integration through the seamless implementation of independent dual 12-bit, 1 MSPS, 17-channel analog-to-digital converters. Most importantly, XA Artix-7 FPGAs proudly meet the high standards of the automotive grade with a maximum temperature of 125°C.
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Xilinx is a leading provider of programmable logic devices and associated technologies. As a top producer of programmable FPGAs, SoCs, MPSoCs, and 3D ICs, Xilinx has expanded quickly. Software defined and hardware optimized applications are supported by Xilinx, advancing the fields of cloud computing, SDN/NFV, video/vision, industrial IoT, and 5G wireless.
One of Xilinx's key innovations is the development of the Xilinx Vivado Design Suite, a comprehensive software toolchain used for designing and programming their FPGAs and SoCs. This suite provides developers with the necessary tools to create, simulate, and implement their designs on Xilinx devices.
In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a major player in the semiconductor industry. This acquisition has enabled AMD to enhance its product portfolio and expand its offerings into the rapidly growing FPGA market.