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XA3S400-4FTG256Q
- Part Number: XA3S400-4FTG256Q
- Categories:
- Manufacturer: Xilinx
- MOQ: 1PCS
- In Stock: 13210
- Datasheet:
- Description: IC FPGA 173 I/O 256FTBGA
- Payment method: Paypal/Wire transfer/Visa
- Delivery Method: UPS/DHL/FEDEX/EMS
Reference Price (In US Dollars)
- 1 Pcs$44.502
- 10 Pcs$42.383
- 100 Pcs$40.364
- 1000 Pcs$39.573
- 10000 Pcs$39.573
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XA3S400-4FTG256Q details
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XA3S400-4FTG256Q Specifications
| Manufacturer | Xilinx |
| Mounting Type | Surface Mount |
| Number of I/O | 173 |
| Package / Case | 256-LBGA |
| Product Status | Active |
| Total RAM Bits | 294912 |
| Number of Gates | 400000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of LABs/CLBs | 896 |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Supplier Device Package | 256-FTBGA (17x17) |
| Number of Logic Elements/Cells | 8064 |
XA3S400-4FTG256Q FPGAs Overview
The Xilinx XA3S400-4FTG256Q of Field-Programmable Gate Arrays meets the needs of high-volume, cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million system gates.
XA devices are available in both extended-temperature Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to +100°C TJ) and are qualified to the industry-recognized AEC-Q100 standard. The XA3S400-4FTG256Q builds on the success of the earlier XA Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. These Spartan-3 enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.
Because of their exceptionally low cost, XA3S400-4FTG256Q FPGAs are ideally suited to a wide range of advanced automotive electronics modules and systems ranging from the latest driver assistance and infotainment systems to instrument clusters and gateways. The XA3S400-4FTG256Q is a flexible alternative to ASICs, ASSPs, and microcontrollers. FPGAs avoid the high initial NREs, the lengthy development cycles, and problems with obsolescence. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary.
The Xilinx FPGAs series XA3S400-4FTG256Q is FPGA Spartan-3 Family 400K Gates 8064 Cells 90nm Technology 1.2V 256Pin FTBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at bitfoic.com, and you can also search for other FPGAs products.Features
• AEC-Q100 device qualification and full PPAP documentation support available in both extended temperature Q-grade and I-grade
• Guaranteed to meet full electrical specification over the TJ = –40°C to +125°C temperature range
• Revolutionary 90-nanometer process technology
• Low cost, high-performance logic solution for high-volume, automotive applications
♦ Three power rails: for core (1.2V), I/Os (1.2V to 3.3V), and auxiliary purposes (2.5V)
• SelectIO interface signaling
♦ Up to 487 I/O pins
♦ 622 Mb/s data transfer rate per I/O
♦ Eighteen single-ended signal standards
♦ Eight differential signal standards including LVDS
♦ Termination by Digitally Controlled Impedance
♦ Signal swing ranging from 1.14V to 3.45V
♦ Double Data Rate (DDR) support
• Logic resources
♦ Abundant logic cells with shift register capability
♦ Wide multiplexers
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XA3S400-4FTG256Q Packaging
step1: Inspect Products
step2: Vacuum Packaging
step3: Anti-Static Bag
step4: Individual Packing
step5: Packing Box
step6：Shipping Tag
- Before shipping, we will inspect the parts to ensure it in good condition and check that the parts are brand-new and original with the datasheet. And then, all the products will be packed in an anti-static bag.
- After ensuring that there are no issues with any of the goods after packing, we will wrap them carefully and send them by international express. It demonstrates exceptional seal integrity, outstanding tear and puncture resistance, and both.
Manufacturer Overview
Xilinx is a leading provider of programmable logic devices and associated technologies. As a top producer of programmable FPGAs, SoCs, MPSoCs, and 3D ICs, Xilinx has expanded quickly. Software defined and hardware optimized applications are supported by Xilinx, advancing the fields of cloud computing, SDN/NFV, video/vision, industrial IoT, and 5G wireless.
One of Xilinx's key innovations is the development of the Xilinx Vivado Design Suite, a comprehensive software toolchain used for designing and programming their FPGAs and SoCs. This suite provides developers with the necessary tools to create, simulate, and implement their designs on Xilinx devices.
In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), a major player in the semiconductor industry. This acquisition has enabled AMD to enhance its product portfolio and expand its offerings into the rapidly growing FPGA market.
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- A temperature transducer is a sensor that can sense temperature and convert it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument, and there are many varieties. After entering the 21st century, temperature sensors are rapidly developing towards high-tech directions such as high precision, multi-function, bus standardization, high reliability and safety, development of virtual sensors and network sensors, and development of single-chip temperature measurement systems. The bus technology of the temperature sensor has also been standardized, and it can be used as a slave to communicate with the host through a dedicated bus interface. According to the measurement method, it can be divided into two categories: a contact type and a non-contact type. According to the characteristics of sensor materials and electronic components, it can be divided into two types: thermal resistance and thermocouple. 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Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. 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The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. Since the temperature is a nonlinear relationship between voltage and temperature, it is necessary to make a second measurement for the reference temperature (Tref), and use the test equipment software or hardware to process the voltage-temperature conversion inside the instrument, to Finally the thermocouple temperature (Tx), is obtained. Both Agilent34970A and 34980A data collectors have built-in measurement computing capabilities. In short, thermocouples are the simplest and most versatile temperature sensors, but thermocouples are not suitable for high-precision measurements and applications. Thermistors are made of semiconductor materials, and most of them have a negative temperature coefficient, that is, the resistance value decreases with the increase in temperature. Temperature changes will cause large resistance changes, so it is the most sensitive temperature sensor. However, the linearity of the thermistor is extremely poor and has a lot to do with the production process. 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