Manufacturer | Chip Quik Inc. |
Form | Jar |
Type | Solder Sphere |
Process | Lead Free |
Diameter | 0.024" (0.61mm) |
Flux Type | - |
Mesh Type | - |
Shelf Life | 24 Months |
Wire Gauge | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Product Status | Active |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | - |