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LFXP2-5E-6QN208I
- Part Number: LFXP2-5E-6QN208I
- Categories:
- Manufacturer: Lattice Semiconductor Corporation
- MOQ: 1PCS
- In Stock: 5557
- Datasheet:
- Description: IC FPGA 146 I/O 208QFP
- Payment method: Paypal/Wire transfer/Visa
- Delivery Method: UPS/DHL/FEDEX/EMS
Reference Price (In US Dollars)
- 1 Pcs$28.265
- 10 Pcs$26.919
- 100 Pcs$25.637
- 1000 Pcs$25.134
- 10000 Pcs$25.134
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Specifications
LFXP2-5E-6QN208I details
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Datasheets
LFXP2-5E-6QN208I Specifications
| Manufacturer | Lattice Semiconductor Corporation |
| Mounting Type | Surface Mount |
| Number of I/O | 146 |
| Package / Case | 208-BFQFP |
| Product Status | Active |
| Total RAM Bits | 169984 |
| Number of Gates | - |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of LABs/CLBs | 625 |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 208-PQFP (28x28) |
| Number of Logic Elements/Cells | 5000 |
LFXP2-5E-6QN208I FPGAs Overview
Lattice's��LatticeXP2��non-volatile��field programmable gate arrayscombine a look-up table-based��FPGA��fabric with Flash non-volatile cells in a��flexiFlash��⒙�architecture. The��flexiFlash��architecture provides instant-on, small footprint, on-chip storage with��FlashBAK��⒙�embedded block memories, Serial TAG memory, and design security. The devices include LUT-based logic, distributed and embedded memory, Phase Locked Loops, pre-engineered source synchronous I/O, and enhanced sysDSP blocks. The product is ideal for high-volume, low-cost applications. The Lattice Programmable Logic ICs series LFXP2-5E-6QN208I is FPGA - Field Programmable Gate Array 5K LUTs 146 I/O Inst on DSP 1.2V -6 Spd, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at bitfoic.com, and you can also search for other FPGAs products.Features
flexiFLASH Architecture
• Instant-on
• Infinitely reconfigurable
• Single chip
• FlashBAK technology
• Serial TAG memory
• Design security
Live Update Technology
• TransFR technology
• Secure updates with 128 bit AES encryption
• Dual-boot with external SPI
sysDSP Block
• Three to eight blocks for high performance Multiply and Accumulate
• 12 to 32 18x18 multipliers
• Each block supports one 36x36 multiplier or four 18x18 or eight 9x9 multipliers
Embedded and Distributed Memory
• Up to 885 Kbits sysMEM EBR
• Up to 83 Kbits Distributed RAM
sysCLOCK PLLs
• Up to four analog PLLs per device
• Clock multiply, divide and phase shifting
Flexible I/O Buffer
• sysIO buffer supports:
– LVCMOS 33/25/18/15/12; LVTTL
– SSTL 33/25/18 class I, II
– HSTL15 class I; HSTL18 class I, II
– PCI
– LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS
Pre-engineered Source Synchronous Interfaces
• DDR / DDR2 interfaces up to 200 MHz
• 7:1 LVDS interfaces support display applications
• XGMII
Density And Package Options
• 5k to 40k LUT4s, 86 to 540 I/Os
• csBGA, TQFP, PQFP, ftBGA and fpBGA packages
• Density migration supported
Flexible Device Configuration
• SPI (master and slave) Boot Flash Interface
• Dual Boot Image supported
• Soft Error Detect (SED) macro embedded
System Level Support
• IEEE 1149.1 and IEEE 1532 Compliant
• On-chip oscillator for initialization & general use
• Devices operate with 1.2V power supply
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LFXP2-5E-6QN208I Packaging
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step2: Vacuum Packaging
step3: Anti-Static Bag
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step5: Packing Box
step6：Shipping Tag
- Before shipping, we will inspect the parts to ensure it in good condition and check that the parts are brand-new and original with the datasheet. And then, all the products will be packed in an anti-static bag.
- After ensuring that there are no issues with any of the goods after packing, we will wrap them carefully and send them by international express. It demonstrates exceptional seal integrity, outstanding tear and puncture resistance, and both.
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Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. 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With the development of infrared technology, radiation temperature measurement has gradually expanded from visible light to infrared and has been used below 700°C to room temperature with high resolution. Working principle Metals undergo a corresponding extension when the ambient temperature changes, so the sensor can signal this response in different ways. Bimetal Sensor A bimetal sheet is composed of two pieces of metal with different expansion coefficients attached. As the temperature changes, material A expands more than the other metal, causing the metal sheet to bend. The curvature of the bend can be converted into an output signal. Bimetal Rod and Tube Sensors As the temperature increases, the length of the metal tube (material A) increases, while the length of the non-expanding steel rod (metal B) does not increase so that the linear expansion of the metal tube can be transmitted due to the change of position. 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There are two types of changes in resistance positive temperature coefficient Increased temperature = increased resistance A decrease in temperature = a decrease in resistance negative temperature coefficient Increased temperature = decreased resistance Decrease in temperature = increase in resistance Thermocouple Sensing A thermocouple consists of two metal wires of different materials welded together at the ends. Then measure the ambient temperature of the non-heating part, and the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities also vary. The sensitivity of the thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1 °C. 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The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. Since the temperature is a nonlinear relationship between voltage and temperature, it is necessary to make a second measurement for the reference temperature (Tref), and use the test equipment software or hardware to process the voltage-temperature conversion inside the instrument, to Finally the thermocouple temperature (Tx), is obtained. Both Agilent34970A and 34980A data collectors have built-in measurement computing capabilities. In short, thermocouples are the simplest and most versatile temperature sensors, but thermocouples are not suitable for high-precision measurements and applications. Thermistors are made of semiconductor materials, and most of them have a negative temperature coefficient, that is, the resistance value decreases with the increase in temperature. Temperature changes will cause large resistance changes, so it is the most sensitive temperature sensor. However, the linearity of the thermistor is extremely poor and has a lot to do with the production process. 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