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LFXP2-40E-6FN484I
- Part Number: LFXP2-40E-6FN484I
- Categories:
- Manufacturer: Analog Devices Inc
- MOQ: 1PCS
- In Stock: 6489
- Datasheet:
- Description: IC FPGA 363 I/O 484FBGA
- Payment method: Paypal/Wire transfer/Visa
- Delivery Method: UPS/DHL/FEDEX/EMS
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LFXP2-40E-6FN484I details
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Datasheets
LFXP2-40E-6FN484I Specifications
| Manufacturer | Analog Devices Inc |
| Mounting Type | Surface Mount |
| Number of I/O | 363 |
| Package / Case | 484-BBGA |
| Product Status | Active |
| Total RAM Bits | 906240 |
| Number of Gates | - |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of LABs/CLBs | 5000 |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 484-FPBGA (23x23) |
| Number of Logic Elements/Cells | 40000 |
LFXP2-40E-6FN484I FPGAs Overview
Lattice's��LatticeXP2��non-volatile��field programmable gate arrayscombine a look-up table-based��FPGA��fabric with Flash non-volatile cells in a��flexiFlash��⒙�architecture. The��flexiFlash��architecture provides instant-on, small footprint, on-chip storage with��FlashBAK��⒙�embedded block memories, Serial TAG memory, and design security. The devices include LUT-based logic, distributed and embedded memory, Phase Locked Loops, pre-engineered source synchronous I/O, and enhanced sysDSP blocks. The product is ideal for high-volume, low-cost applications. The Lattice FPGA - Field Programmable Gate Array series LFXP2-40E-6FN484I is FPGA - Field Programmable Gate Array 40K LUTs 363 I/O Ins on DSP 1.2V -6 Spd, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at bitfoic.com, and you can also search for other FPGAs products.Features
flexiFLASH Architecture
• Instant-on
• Infinitely reconfigurable
• Single chip
• FlashBAK technology
• Serial TAG memory
• Design security
Live Update Technology
• TransFR technology
• Secure updates with 128 bit AES encryption
• Dual-boot with external SPI
sysDSP Block
• Three to eight blocks for high performance Multiply and Accumulate
• 12 to 32 18x18 multipliers
• Each block supports one 36x36 multiplier or four 18x18 or eight 9x9 multipliers
Embedded and Distributed Memory
• Up to 885 Kbits sysMEM EBR
• Up to 83 Kbits Distributed RAM
sysCLOCK PLLs
• Up to four analog PLLs per device
• Clock multiply, divide and phase shifting
Flexible I/O Buffer
• sysIO buffer supports:
– LVCMOS 33/25/18/15/12; LVTTL
– SSTL 33/25/18 class I, II
– HSTL15 class I; HSTL18 class I, II
– PCI
– LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS
Pre-engineered Source Synchronous Interfaces
• DDR / DDR2 interfaces up to 200 MHz
• 7:1 LVDS interfaces support display applications
• XGMII
Density And Package Options
• 5k to 40k LUT4s, 86 to 540 I/Os
• csBGA, TQFP, PQFP, ftBGA and fpBGA packages
• Density migration supported
Flexible Device Configuration
• SPI (master and slave) Boot Flash Interface
• Dual Boot Image supported
• Soft Error Detect (SED) macro embedded
System Level Support
• IEEE 1149.1 and IEEE 1532 Compliant
• On-chip oscillator for initialization & general use
• Devices operate with 1.2V power supply
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LFXP2-40E-6FN484I Packaging
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step2: Vacuum Packaging
step3: Anti-Static Bag
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step6：Shipping Tag
- Before shipping, we will inspect the parts to ensure it in good condition and check that the parts are brand-new and original with the datasheet. And then, all the products will be packed in an anti-static bag.
- After ensuring that there are no issues with any of the goods after packing, we will wrap them carefully and send them by international express. It demonstrates exceptional seal integrity, outstanding tear and puncture resistance, and both.
Manufacturer Overview
Analog Devices Inc. (ADI) is an American multinational semiconductor company specializing in
the design, manufacture, and marketing of a wide variety of high-performance integrated circuits (ICs) for the processing of analog, mixed-signal, and digital signals (DSP) in virtually all electronic systems. The engineering issue in electronic equipment connected to signal to process has been the main emphasis since we began in 1965. Over 100,000 customers worldwide rely on our signal processing solutions to convert, condition, and process real-world events like temperature, pressure, sonority, illumination, speed, and movement into electric signals for a variety of electronic devices.
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- A temperature transducer is a sensor that can sense temperature and convert it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument, and there are many varieties. After entering the 21st century, temperature sensors are rapidly developing towards high-tech directions such as high precision, multi-function, bus standardization, high reliability and safety, development of virtual sensors and network sensors, and development of single-chip temperature measurement systems. The bus technology of the temperature sensor has also been standardized, and it can be used as a slave to communicate with the host through a dedicated bus interface. According to the measurement method, it can be divided into two categories: a contact type and a non-contact type. According to the characteristics of sensor materials and electronic components, it can be divided into two types: thermal resistance and thermocouple. Main Category The detection part of the contact temperature sensor is in good contact with the measured object, also known as a thermometer. The thermometer achieves heat balance through conduction or convection so that the indication value of the thermometer can directly represent the temperature of the measured object. Generally, the measurement accuracy is high. Within a certain temperature range, the thermometer can also measure the temperature distribution inside the object. However, large measurement errors will occur for moving bodies, small targets, or objects with small heat capacity. Commonly used thermometers include bimetallic thermometers, liquid-in-glass thermometers, pressure thermometers, resistance thermometers, thermistors, and thermocouples. They are widely used in industry, agriculture, commerce, and other sectors. People also often use these thermometers in daily life. With the wide application of cryogenic technology in national defense engineering, space technology, metallurgy, electronics, food, medicine, petrochemical, and other departments and the research of superconducting technology, cryogenic thermometers for measuring temperatures below 120K have been developed, such as cryogenic gas thermometers, steam Pressure thermometers, acoustic thermometers, paramagnetic salt thermometers, quantum thermometers, low-temperature thermal resistance, and low-temperature thermocouples, etc. Cryogenic thermometers require small temperature sensing elements, high accuracy, good reproducibility, and stability. The carburized glass thermal resistance made of porous high silica glass carburized and sintered is a kind of temperature sensing element of the low-temperature thermometer, which can be used to measure the temperature in the range of 1.6 ~ 300K. Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. Only the temperature measured for a black body (an object that absorbs all radiation and does not reflect light) is the true temperature. If you want to measure the real temperature of the object, you must correct the surface emissivity of the material. However, the surface emissivity of materials depends not only on temperature and wavelength, but also on surface state, coating film, and microstructure, so it is difficult to measure accurately. In automatic production, it is often necessary to use radiation thermometry to measure or control the surface temperature of certain objects, such as the steel strip rolling temperature, roll temperature, forging temperature in metallurgy, and the temperature of various molten metals in smelting furnaces or crucibles. In these specific cases, the measurement of the emissivity of an object's surface is quite difficult. For automatic measurement and control of solid surface temperature, an additional reflector can be used to form a black body cavity together with the measured surface. The effect of additional radiation can increase the effective radiation and effective emissivity of the measured surface. Use the effective emissivity coefficient to correct the measured temperature through the instrument, and finally get the real temperature of the measured surface. The most typical additional mirror is hemispherical. The diffuse radiation on the measured surface near the center of the sphere can be reflected on the surface by the hemispherical mirror to form additional radiation, thereby increasing the effective emissivity coefficient. In the formula, ε is the surface emissivity of the material, and ρ is the reflectivity of the mirror. As for the radiation measurement of the real temperature of the gas and liquid medium, the method of inserting the heat-resistant material tube to a certain depth to form a black body cavity can be used. The effective emission coefficient of the cylinder cavity after reaching thermal equilibrium with the medium is obtained by calculation. In automatic measurement and control, this value can be used to correct the measured cavity bottom temperature (ie medium temperature) to obtain the real temperature of the medium. Advantages of non-contact temperature measurement: the upper limit of measurement is not limited by the temperature resistance of the temperature sensing element, so there is no limit to the maximum measurable temperature in principle. For high temperatures above 1800°C, non-contact temperature measurement methods are mainly used. With the development of infrared technology, radiation temperature measurement has gradually expanded from visible light to infrared and has been used below 700°C to room temperature with high resolution. Working principle Metals undergo a corresponding extension when the ambient temperature changes, so the sensor can signal this response in different ways. Bimetal Sensor A bimetal sheet is composed of two pieces of metal with different expansion coefficients attached. As the temperature changes, material A expands more than the other metal, causing the metal sheet to bend. The curvature of the bend can be converted into an output signal. Bimetal Rod and Tube Sensors As the temperature increases, the length of the metal tube (material A) increases, while the length of the non-expanding steel rod (metal B) does not increase so that the linear expansion of the metal tube can be transmitted due to the change of position. 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There are two types of changes in resistance positive temperature coefficient Increased temperature = increased resistance A decrease in temperature = a decrease in resistance negative temperature coefficient Increased temperature = decreased resistance Decrease in temperature = increase in resistance Thermocouple Sensing A thermocouple consists of two metal wires of different materials welded together at the ends. Then measure the ambient temperature of the non-heating part, and the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities also vary. The sensitivity of the thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1 °C. For most thermocouples supported by metallic materials, this value is between 5 and 40 microvolts/°C. Since the sensitivity of the thermocouple temperature sensor has nothing to do with the thickness of the material, it can also be made into a temperature sensor with very thin materials. Also due to the good ductility of the metal material used to make thermocouples, this tiny temperature-measuring element has a very high response speed and can measure rapidly changing processes. Selection method If you want to make reliable temperature measurements, you first need to choose the correct temperature instrument, that is, the temperature sensor. Among them, thermocouples, thermistors, platinum resistance thermometers (RTDs), and temperature ICs are the most commonly used temperature sensors in testing. The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. Since the temperature is a nonlinear relationship between voltage and temperature, it is necessary to make a second measurement for the reference temperature (Tref), and use the test equipment software or hardware to process the voltage-temperature conversion inside the instrument, to Finally the thermocouple temperature (Tx), is obtained. Both Agilent34970A and 34980A data collectors have built-in measurement computing capabilities. In short, thermocouples are the simplest and most versatile temperature sensors, but thermocouples are not suitable for high-precision measurements and applications. Thermistors are made of semiconductor materials, and most of them have a negative temperature coefficient, that is, the resistance value decreases with the increase in temperature. Temperature changes will cause large resistance changes, so it is the most sensitive temperature sensor. However, the linearity of the thermistor is extremely poor and has a lot to do with the production process. 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