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LFE2M50E-5FN900C
- Part Number: LFE2M50E-5FN900C
- Categories:
- Manufacturer: Analog Devices Inc
- MOQ: 1PCS
- In Stock: 17561
- Datasheet:
- Description: IC FPGA 410 I/O 900FBGA
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Datasheets
LFE2M50E-5FN900C Specifications
| Manufacturer | Analog Devices Inc |
| Mounting Type | Surface Mount |
| Number of I/O | 410 |
| Package / Case | 900-BBGA |
| Product Status | Active |
| Total RAM Bits | 4246528 |
| Number of Gates | - |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of LABs/CLBs | 6000 |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Supplier Device Package | 900-FPBGA (31x31) |
| Number of Logic Elements/Cells | 48000 |
LFE2M50E-5FN900C FPGAs Overview
The LatticeECP2/M family of FPGA devices is optimized to deliver high performance features such as advanced DSP blocks, high speed SERDES (LatticeECP2M family only) and high speed source synchronous interfaces in an economical FPGA fabric. This combination was achieved through advances in device architecture and the use of 90nm technology. The LatticeECP2/M FPGA fabric is optimized with high performance and low cost in mind. The LatticeECP2/M devices include LUT-based logic, distributed and embedded memory, Phase Locked Loops (PLLs), Delay Locked Loops (DLLs), pre-engineered source synchronous I/O support, enhanced sysDSP blocks and advanced configuration support, including encryption (���S��� versions only) and dual boot capabilities. The LatticeECP2M device family features high speed SERDES with PCS. These high jitter tolerance and low transmission jitter SERDES with PCS blocks can be configured to support an array of popular data protocols including PCI Express, Ethernet (1GbE and SGMII), OBSAI and CPRI. Transmit Pre-emphasis and Receive Equalization settings make SERDES suitable for chip to chip and small form factor backplane applications. Lattice Diamond庐 design software allows large complex designs to be efficiently implemented using the LatticeECP2/M FPGA family. Synthesis library support for LatticeECP2/M is available for popular logic synthesis tools. The Diamond software uses the synthesis tool output along with the constraints from its floor planning tools to place and route the design in the LatticeECP2/M device. The Diamond design tool extracts the timing from the routing and back-annotates it into the design for timing verification. Lattice provides many pre-engineered IP (Intellectual Property) modules for the LatticeECP2/M family. By using these IP cores as standardized blocks, designers are free to concentrate on the unique aspects of their design, increasing their productivity. The Lattice FPGA - Field Programmable Gate Array series LFE2M50E-5FN900C is FPGA - Field Programmable Gate Array 48K LUTs 410 I/O Memory DSP 1.2V 5SPD, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at bitfoic.com, and you can also search for other FPGAs products.Features
■ High Logic Density for System Integration
• 6K to 95K LUTs
• 90 to 583 I/Os
■ Embedded SERDES (LatticeECP2M Only)
• Data Rates 250 Mbps to 3.125 Gbps
• Up to 16 channels per device PCI Express, Ethernet (1GbE, SGMII), OBSAI, CPRI and Serial RapidIO.
■ sysDSP Block
• 3 to 42 blocks for high performance multiply and accumulate
• Each block supports – One 36x36, four 18X18 or eight 9X9 multipliers
■ Flexible Memory Resources
• 55Kbits to 5308Kbits sysMEM Embedded Block RAM (EBR)
– 18Kbit block
– Single, pseudo dual and true dual port
– Byte Enable Mode support
• 12K to 202Kbits distributed RAM
– Single port and pseudo dual port
■ sysCLOCK Analog PLLs and DLLs
• Two GPLLs and up to six SPLLs per device
– Clock multiply, divide, phase & delay adjust
– Dynamic PLL adjustment
• Two general purpose DLLs per device
■ Pre-Engineered Source Synchronous I/O
• DDR registers in I/O cells
• Dedicated gearing logic
• Source synchronous standards support
– SPI4.2, SFI4 (DDR Mode), XGMII
– High Speed ADC/DAC devices
• Dedicated DDR and DDR2 memory support
– DDR1: 400 (200MHz) / DDR2: 533 (266MHz)
• Dedicated DQS support
■ Programmable sysI/O Buffer Supports Wide Range Of Interfaces
• LVTTL and LVCMOS 33/25/18/15/12
• SSTL 3/2/18 I, II
• HSTL15 I and HSTL18 I, II
• PCI and Differential HSTL, SSTL
• LVDS, RSDS, Bus-LVDS, MLVDS, LVPECL
■ Flexible Device Configuration
• 1149.1 Boundary Scan compliant
• Dedicated bank for configuration I/Os
• SPI boot flash interface
• Dual boot images supported
• TransFR I/O for simple field updates
• Soft Error Detect macro embedded
■ Optional Bitstream Encryption (LatticeECP2/M “S” Versions Only)
■ System Level Support
• ispTRACY internal logic analyzer capability
• On-chip oscillator for initialization & general use
• 1.2V power supply
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LFE2M50E-5FN900C Packaging
step1: Inspect Products
step2: Vacuum Packaging
step3: Anti-Static Bag
step4: Individual Packing
step5: Packing Box
step6：Shipping Tag
- Before shipping, we will inspect the parts to ensure it in good condition and check that the parts are brand-new and original with the datasheet. And then, all the products will be packed in an anti-static bag.
- After ensuring that there are no issues with any of the goods after packing, we will wrap them carefully and send them by international express. It demonstrates exceptional seal integrity, outstanding tear and puncture resistance, and both.
Manufacturer Overview
Analog Devices Inc. (ADI) is an American multinational semiconductor company specializing in
the design, manufacture, and marketing of a wide variety of high-performance integrated circuits (ICs) for the processing of analog, mixed-signal, and digital signals (DSP) in virtually all electronic systems. The engineering issue in electronic equipment connected to signal to process has been the main emphasis since we began in 1965. Over 100,000 customers worldwide rely on our signal processing solutions to convert, condition, and process real-world events like temperature, pressure, sonority, illumination, speed, and movement into electric signals for a variety of electronic devices.
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Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. 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There are two types of changes in resistance positive temperature coefficient Increased temperature = increased resistance A decrease in temperature = a decrease in resistance negative temperature coefficient Increased temperature = decreased resistance Decrease in temperature = increase in resistance Thermocouple Sensing A thermocouple consists of two metal wires of different materials welded together at the ends. Then measure the ambient temperature of the non-heating part, and the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities also vary. The sensitivity of the thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1 °C. For most thermocouples supported by metallic materials, this value is between 5 and 40 microvolts/°C. Since the sensitivity of the thermocouple temperature sensor has nothing to do with the thickness of the material, it can also be made into a temperature sensor with very thin materials. Also due to the good ductility of the metal material used to make thermocouples, this tiny temperature-measuring element has a very high response speed and can measure rapidly changing processes. Selection method If you want to make reliable temperature measurements, you first need to choose the correct temperature instrument, that is, the temperature sensor. Among them, thermocouples, thermistors, platinum resistance thermometers (RTDs), and temperature ICs are the most commonly used temperature sensors in testing. The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. 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