LCMXO3D-9400ZC-3BG256C

LCMXO3D-9400ZC-3BG256C FPGAs Overview

The LCMXO3D-9400 is the next generation of Lattice Semiconductor Low Density PLDs including enhanced security features and on-chip dual boot flash. The enhanced security features include Advanced Encryption Standard (AES) AES-128/256, Secure Hash Algorithm (SHA) SHA-256, Elliptic Curve Digital Signature Algorithm (ECDSA), Elliptic Curve Integrated Encryption Scheme (ECIES), Hash Message Authentication Code (HMAC) HMAC-SHA256, Public Key Cryptography, and Unique Secure ID. The LCMXO3D-9400ZC-3BG256C is a Root-of-Trust hardware solution that can easily scale to protect the whole system with its enhanced bitstream security and user mode functions.

The LCMXO3D-9400ZC-3BG256C device provides breakthrough I/O density with high number of options for I/O programmability. The device I/O features the support for latest industry standard I/O, including programmable slew-rate enhancements and I3C support.The LCMXO3D-9400ZC-3BG256C of low power, instant-on, Flash based PLDs have two devices with densities of 4300 and 9400 Look-Up Tables (LUTs). MachXO3D devices include on-chip dual boot configuration flash as well as multi-sectored User Flash Memory (UFM). In addition to LUT-based programmable logic, these devices feature Embedded Block RAM (EBR), Distributed RAM, Phase Locked Loops (PLLs), pre-engineered source synchronous I/O support, advanced configuration support including on-chip dual-boot capability and hardened versions of commonly used functions such as SPI controller, I2C controller, and timer/counter.

The LCMXO3D-9400ZC-3BG256C are designed on a 65-nm non-volatile low power process. The device architecture has several features such as programmable low swing differential I/O and the ability to turn off I/O banks, on-chip PLLs and oscillators dynamically. These features help manage static and dynamic power consumption resulting in low power for all members of the family.The LCMXO3D-9400ZC-3BG256C devices are available in two performance levels: ultra low power (ZC) and high performance (HC). The ultra low power devices are offered in two speed grades: –2 and –3, with –3 being the fastest. Similarly, the high-performance devices are offered in two speed grades: –5 and –6, with –6 being the fastest. ZC/HC devices have an internal linear voltage regulator, which supports external VCC supply voltages of 3.3 V or 2.5 V. With the exception of power/performance profiles, the two types of devices, ZC and HC, are pin compatible with each other.

The LCMXO3D-9400ZC-3BG256C PLDs are available in a broad range of advanced halogen-free packages ranging from the space saving 10 x 10 mm QFN to the 19 x 19 mm caBGA. MachXO3D devices support density migration within the same package.The LCMXO3D-9400ZC-3BG256C offer enhanced I/O features such as drive strength control, finer slew rate control, I3C compatibility, bus-keeper latches, pull-up resistors, pull-down resistors, open drain outputs, and hot socketing. Pull-up, pull-down, and bus-keeper features are controllable on a per-pin basis.

A user-programmable internal oscillator is included in MachXO3D devices. The clock output from this oscillator may be divided by the timer or counter for use as clock input in functions such as LED control, key-board scanner, and similar state machines.The LCMXO3D-9400ZC-3BG256C devices also provide flexible, reliable, and secure configuration from on-chip Flash with the encryption and authentication options. These devices can also configure themselves from external SPI Flash or be configured by an external master through the JTAG test access port or through the SPI/I2C port. Additionally, MachXO3D devices support on-chip dual-boot capability to reduce the system cost and remote field upgrade TransFR capability.

Lattice Semiconductor provides a variety of design tools that allow complex designs to be efficiently implemented using The LCMXO3D-9400ZC-3BG256C devices. Popular logic synthesis tools provide synthesis library support for MachXO3D devices. Lattice design tools use the synthesis tool output along with the user-specified preferences and constraints to place and route the design in The LCMXO3D-9400ZC-3BG256C device. These tools extract the timing from the routing and back-annotate it into the design for timing verification.

Lattice Semiconductor provides many pre-engineered Intellectual Property (IP) LatticeCORETM modules, including a number of reference designs licensed free of charge, optimized for The LCMXO3D-9400ZC-3BG256C PLD. By using these configurable soft core IP cores as standardized blocks, you are free to concentrate on the unique aspects of their design, increasing their productivity.

Features

1.1.1. Solutions

 Best-In-Class control PLD with advanced security functions, provide secure/authenticated boot and root of trust function

 Optimized footprint, logic density, I/O count, I/O performance devices for I/O management and logic applications

 High I/O logic, high I/O devices for I/O expansion applications

1.1.2. Flexible Architecture

 Logic Density ranging from 4.3K to 9.4K LUT4

 High I/O to LUT ratio with up to 383 I/O pins

1.1.3. Dedicated Embedded Security Block

 Advanced Encryption Standard (AES): AES-128/256 Encryption/Decryption

 Secure Hash Algorithm (SHA): SHA-256

 Elliptic Curve Digital Signature Algorithm (ECDSA): ECDSA-based authentication

 Hash Message Authentication Code (HMAC): HMAC-SHA256

 Elliptic Curve Integrated Encryption Scheme (ECIES): ECIES Encryption and Decryption

 True Random Number Generator (TRNG)

 Key Management using Elliptic Curve DiffieHellman (ECDH) Public Key Cryptography

 Unique Secure ID

 Guard against malicious attacks

 Interface for user logic via WISHBONE and High Speed Port (HSP)

 Federal Information Processing Standard (FIPS) supported Security Protocols

1.1.4. Pre-Engineered Source Synchronous I/O

 DDR registers in I/O cells

 Dedicated gearing logic

 7:1 Gearing for Display I/O

 Generic DDR, DDRx2, DDRx4

1.1.5. High Performance, Flexible I/O Buffer

 Programmable sysI/OTM buffer supports wide range of interfaces:

 LVCMOS 3.3/2.5/1.8/1.5/1.2

 LVTTL

 LVDS, Bus-LVDS, MLVDS, LVPECL

 MIPI D-PHY Emulated

 Schmitt trigger inputs, up to 0.5 V hysteresis

 Ideal for I/O bridging applications

 I3C compatible on selective I/O

 Slew rate control as Slow/Fast

 I/O support hot socketing

 On-chip differential termination

 Programmable pull-up or pull-down mode

1.1.6. Flexible On-Chip Clocking

 Eight primary clocks

 Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)

 Two analog PLLs per device with fractional-n frequency synthesis

 Wide input frequency range (7 MHz to 400 MHz).

1.1.7. Non-volatile, Reconfigurable

 Instant-on

 Powers up in microseconds

 On-chip dual boot

 Multi-sectored UFM for customer data storage

 Single-chip, secure solution

 Programmable through JTAG, SPI or I2C

 Reconfigurable Flash

 Supports background programming of non-volatile memory

1.1.5. High Performance, Flexible I/O Buffer

 Programmable sysI/OTM buffer supports wide range of interfaces:

 LVCMOS 3.3/2.5/1.8/1.5/1.2

 LVTTL  LVDS, Bus-LVDS, MLVDS, LVPECL

 MIPI D-PHY Emulated

 Schmitt trigger inputs, up to 0.5 V hysteresis

 Ideal for I/O bridging applications

 I3C compatible on selective I/O

 Slew rate control as Slow/Fast

 I/O support hot socketing

 On-chip differential termination

 Programmable pull-up or pull-down mode

1.1.6. Flexible On-Chip Clocking

 Eight primary clocks

 Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)

 Two analog PLLs per device with fractional-n frequency synthesis

 Wide input frequency range (7 MHz to 400 MHz).

1.1.7. Non-volatile, Reconfigurable

 Instant-on

 Powers up in microseconds

 On-chip dual boot

 Multi-sectored UFM for customer data storage

 Single-chip, secure solution

 Programmable through JTAG, SPI or I2C

 Reconfigurable Flash

 Supports background programming of non-volatile memory

1.1.10. Advanced Packaging

 0.5 mm pitch: 4.3K to 9.4K densities with up to 58 I/O in QFN packages

 0.8 mm pitch: 4.3K to 9.4K densities with up to 383 I/O in BGA packages

 Pin-compatible with MachXO3LF product family of devices