Manufacturer | Flip Electronics |
Mounting Type | Surface Mount |
Number of I/O | 193 |
Package / Case | 256-BGA |
Product Status | Obsolete |
Number of Gates | - |
Programmable Type | In System Programmable |
Number of Macrocells | 512 |
Delay Time tpd(1) Max | 4.5 ns |
Operating Temperature | 0°C ~ 90°C (TJ) |
Supplier Device Package | 256-FPBGA (17x17) |
Voltage Supply - Internal | 3V ~ 3.6V |
Number of Logic Elements/Blocks | 16 |
■ Flexible Multi-Function Block (MFB) Architecture
• SuperWIDE logic (up to 136 inputs)
• Arithmetic capability
• Single- or Dual-port SRAM
• FIFO
• Ternary CAM
■ sysCLOCK PLL Timing Control
• Multiply and divide between 1 and 32
• Clock shifting capability
• External feedback capability
■ sysIO Interfaces
• LVCMOS 1.8, 2.5, 3.3V
– Programmable impedance
– Hot-socketing
– Flexible bus-maintenance (Pull-up, pulldown, bus-keeper, or none)
– Open drain operation
• SSTL 2, 3 (I & II)
• HSTL (I, III, IV)
• PCI 3.3
• GTL+
• LVDS
• LVPECL
• LVTTL
■ Expanded In-System Programmability (ispXP)
• Instant-on capability
• Single chip convenience
• In-System Programmable via IEEE 1532 Interface
• Infinitely reconfigurable via IEEE 1532 or sysCONFIG microprocessor interface
• Design security
■ High Speed Operation
• 4.0ns pin-to-pin delays, 300MHz fMAX
• Deterministic timing
■ Low Power Consumption
• Typical static power: 20 to 50mA (1.8V), 30 to 60mA (2.5/3.3V)
• 1.8V core for low dynamic power
■ Easy System Integration
• 3.3V (5000MV), 2.5V (5000MB) and 1.8V (5000MC) power supply operation
• 5V tolerant I/O for LVCMOS 3.3 and LVTTL interfaces
• IEEE 1149.1 interface for boundary scan testing
• sysIO quick configuration
• Density migration
• Multiple density and package options
• PQFP and fine pitch BGA packaging
• Lead-free package options