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EP1K10QC208-2N
- Part Number: EP1K10QC208-2N
- Categories:
- Manufacturer: Rochester Electronics, LLC
- MOQ: 1PCS
- In Stock: 2073
- Datasheet:
- Description: IC FPGA 120 I/O 208QFP
- Payment method: Paypal/Wire transfer/Visa
- Delivery Method: UPS/DHL/FEDEX/EMS
Reference Price (In US Dollars)
- 1 Pcs$0.014
- 10 Pcs$0.013
- 100 Pcs$0.012
- 1000 Pcs$0.012
- 10000 Pcs$0.012
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Specifications
EP1K10QC208-2N details
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Datasheets
EP1K10QC208-2N Specifications
| Manufacturer | Rochester Electronics, LLC |
| Mounting Type | Surface Mount |
| Number of I/O | 120 |
| Package / Case | 208-BFQFP |
| Product Status | Obsolete |
| Total RAM Bits | 12288 |
| Number of Gates | 56000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Number of LABs/CLBs | 72 |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Supplier Device Package | 208-PQFP (28x28) |
| Number of Logic Elements/Cells | 576 |
EP1K10QC208-2N FPGAs Overview
Altera EP1K10QC208-2N devices provide a die-efficient, low-cost architecture by combining look-up table (LUT) architecture with EABs. LUT-based logic provides optimized performance and efficiency for data-path, register intensive, mathematical, or digital signal processing (DSP) designs, while EABs implement RAM, ROM, dual-port RAM, or first-in first-out (FIFO) functions. These elements make ACEX 1K suitable for complex logic functions and memory functions such as digital signal processing, wide data-path manipulation, data transformation and microcontrollers, as required in high-performance communications applications.
Based on reconfigurable CMOS SRAM elements, the EP1K10QC208-2N architecture incorporates all features necessary to implement common gate array megafunctions, along with a high pin count to enable an effective interface with system components. The advanced process and the low voltage requirement of the 2.5-V core allow EP1K10QC208-2N devices to meet the requirements of low-cost, high-volume applications ranging from DSL modems to low-cost switches.
The ability to reconfigure EP1K10QC208-2N devices enables complete testing prior to shipment and allows the designer to focus on simulation and design verification. EP1K10QC208-2N device reconfigurability eliminates inventory management for gate array designs and test vector generation for fault coverage.
Features
Programmable logic devices (PLDs), providing low cost system-on-a-programmable-chip (SOPC) integration in a single device
– Enhanced embedded array for implementing megafunctions such as efficient memory and specialized logic functions
– Dual-port capability with up to 16-bit width per embedded array block (EAB)
– Logic array for general logic functions
■ High density
– 10,000 to 100,000 typical gates (see Table 1)
– Up to 49,152 RAM bits (4,096 bits per EAB, all of which can be used without reducing logic capacity)
■ Cost-efficient programmable architecture for high-volume applications
– Cost-optimized process
– Low cost solution for high-performance communications applications
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EP1K10QC208-2N Packaging
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- A temperature transducer is a sensor that can sense temperature and convert it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument, and there are many varieties. After entering the 21st century, temperature sensors are rapidly developing towards high-tech directions such as high precision, multi-function, bus standardization, high reliability and safety, development of virtual sensors and network sensors, and development of single-chip temperature measurement systems. The bus technology of the temperature sensor has also been standardized, and it can be used as a slave to communicate with the host through a dedicated bus interface. According to the measurement method, it can be divided into two categories: a contact type and a non-contact type. According to the characteristics of sensor materials and electronic components, it can be divided into two types: thermal resistance and thermocouple. 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Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. Only the temperature measured for a black body (an object that absorbs all radiation and does not reflect light) is the true temperature. If you want to measure the real temperature of the object, you must correct the surface emissivity of the material. However, the surface emissivity of materials depends not only on temperature and wavelength, but also on surface state, coating film, and microstructure, so it is difficult to measure accurately. In automatic production, it is often necessary to use radiation thermometry to measure or control the surface temperature of certain objects, such as the steel strip rolling temperature, roll temperature, forging temperature in metallurgy, and the temperature of various molten metals in smelting furnaces or crucibles. In these specific cases, the measurement of the emissivity of an object's surface is quite difficult. 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As for the radiation measurement of the real temperature of the gas and liquid medium, the method of inserting the heat-resistant material tube to a certain depth to form a black body cavity can be used. The effective emission coefficient of the cylinder cavity after reaching thermal equilibrium with the medium is obtained by calculation. In automatic measurement and control, this value can be used to correct the measured cavity bottom temperature (ie medium temperature) to obtain the real temperature of the medium. Advantages of non-contact temperature measurement: the upper limit of measurement is not limited by the temperature resistance of the temperature sensing element, so there is no limit to the maximum measurable temperature in principle. For high temperatures above 1800°C, non-contact temperature measurement methods are mainly used. With the development of infrared technology, radiation temperature measurement has gradually expanded from visible light to infrared and has been used below 700°C to room temperature with high resolution. Working principle Metals undergo a corresponding extension when the ambient temperature changes, so the sensor can signal this response in different ways. Bimetal Sensor A bimetal sheet is composed of two pieces of metal with different expansion coefficients attached. As the temperature changes, material A expands more than the other metal, causing the metal sheet to bend. The curvature of the bend can be converted into an output signal. Bimetal Rod and Tube Sensors As the temperature increases, the length of the metal tube (material A) increases, while the length of the non-expanding steel rod (metal B) does not increase so that the linear expansion of the metal tube can be transmitted due to the change of position. 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There are two types of changes in resistance positive temperature coefficient Increased temperature = increased resistance A decrease in temperature = a decrease in resistance negative temperature coefficient Increased temperature = decreased resistance Decrease in temperature = increase in resistance Thermocouple Sensing A thermocouple consists of two metal wires of different materials welded together at the ends. Then measure the ambient temperature of the non-heating part, and the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities also vary. The sensitivity of the thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1 °C. 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The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. 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