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A1460A-1PQG208C
- Part Number: A1460A-1PQG208C
- Categories:
- Manufacturer: Microsemi Corporation
- MOQ: 1PCS
- In Stock: 300
- Datasheet:
- Description: IC FPGA 167 I/O 208QFP
- Payment method: Paypal/Wire transfer/Visa
- Delivery Method: UPS/DHL/FEDEX/EMS
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A1460A-1PQG208C details
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Datasheets
A1460A-1PQG208C Specifications
| Manufacturer | Microsemi Corporation |
| Mounting Type | Surface Mount |
| Number of I/O | 167 |
| Package / Case | 208-BFQFP |
| Product Status | Obsolete |
| Total RAM Bits | - |
| Number of Gates | 6000 |
| Voltage - Supply | 4.5V ~ 5.5V |
| Number of LABs/CLBs | 848 |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Supplier Device Package | 208-PQFP (28x28) |
| Number of Logic Elements/Cells | - |
A1460A-1PQG208C FPGAs Overview
Microsemi’s ACT 3 Accelerator Series of FPGAs offers the industry’s fastest high-capacity programmable logic device. ACT 3 FPGAs offer a high performance, PCI compliant programmable solution capable of 186 MHz on-chip performance and 9.0 nanosecond clock-to-output (–1 speed grade), with capacities spanning from 1,500 to 10,000 gate array equivalent gates.
The ACT 3 family builds on the proven two-module architecture consisting of combinatorial and sequential logic modules used in Microsemi’s 3200DX and 1200XL families. In addition, the ACT 3 I/O modules contain registers which deliver 9.0 nanosecond clock-to-out times (–1 speed grade). The devices contain four clock distribution networks, including dedicated array and I/O clocks, supporting very fast synchronous and asynchronous designs. In addition, routed clocks can be used to drive high fanout signals such as flip-flop resets and output.
The ACT 3 family is supported by Microsemi’s Designer Series Development System which offers automatic placement and routing (with automatic or fixed pin assignments), static timing analysis, user programming, and debug and diagnostic probe capabilities.
The Microsemi Embedded - FPGAs (Field Programmable Gate Array) series A1460A-1PQG208C is IC FPGA 167 I/O 208QFP, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at bitfoic.com, and you can also search for other FPGAs products.Features
• Up to 10,000 Gate Array Equivalent Gates (up to 25,000 equivalent PLD Gates)• Highly Predictable Performance with 100% Automatic Placeand-Route
• As Low as 9.0 ns Clock-to-Output Times (–1 Speed Grade)
• Up to 186 MHz On-Chip Performance (–1 Speed Grade)
• Up to 228 User-Programmable I/O Pins
• Four Fast, Low-Skew Clock Networks
• More than 500 Macro Functions
• Replaces up to Twenty 32 Macro-Cell CPLDs
• Replaces up to One Hundred 20-Pin PAL Packages
• Up to 1,153 Dedicated Flip-Flops
• VQFP, TQFP, BGA, and PQFP Packages
• Nonvolatile, User Programmable
• Fully Tested Prior to Shipment
• 5.0 V and 3.3 V Versions
• Optimized for Logic Synthesis Methodologies
• Low Power CMOS Technology
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A1460A-1PQG208C Packaging
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Its sensitive components are not in contact with the measured object, also known as a non-contact temperature measuring instrument. This instrument can be used to measure the surface temperature of moving objects, small targets, and objects with small heat capacity or rapid temperature changes (transient), and can also be used to measure the temperature distribution of the temperature field. The most commonly used non-contact thermometers are based on the fundamental law of black body radiation and are called radiation thermometers. Radiation thermometry methods include the brightness method (see optical pyrometer), radiation method (see radiation pyrometer), and colorimetric method (see colorimetric thermometer). All kinds of radiation temperature measurement methods can only measure the corresponding photometric temperature, radiation temperature, or colorimetric temperature. Only the temperature measured for a black body (an object that absorbs all radiation and does not reflect light) is the true temperature. If you want to measure the real temperature of the object, you must correct the surface emissivity of the material. However, the surface emissivity of materials depends not only on temperature and wavelength, but also on surface state, coating film, and microstructure, so it is difficult to measure accurately. In automatic production, it is often necessary to use radiation thermometry to measure or control the surface temperature of certain objects, such as the steel strip rolling temperature, roll temperature, forging temperature in metallurgy, and the temperature of various molten metals in smelting furnaces or crucibles. In these specific cases, the measurement of the emissivity of an object's surface is quite difficult. For automatic measurement and control of solid surface temperature, an additional reflector can be used to form a black body cavity together with the measured surface. The effect of additional radiation can increase the effective radiation and effective emissivity of the measured surface. Use the effective emissivity coefficient to correct the measured temperature through the instrument, and finally get the real temperature of the measured surface. The most typical additional mirror is hemispherical. The diffuse radiation on the measured surface near the center of the sphere can be reflected on the surface by the hemispherical mirror to form additional radiation, thereby increasing the effective emissivity coefficient. In the formula, ε is the surface emissivity of the material, and ρ is the reflectivity of the mirror. As for the radiation measurement of the real temperature of the gas and liquid medium, the method of inserting the heat-resistant material tube to a certain depth to form a black body cavity can be used. The effective emission coefficient of the cylinder cavity after reaching thermal equilibrium with the medium is obtained by calculation. In automatic measurement and control, this value can be used to correct the measured cavity bottom temperature (ie medium temperature) to obtain the real temperature of the medium. Advantages of non-contact temperature measurement: the upper limit of measurement is not limited by the temperature resistance of the temperature sensing element, so there is no limit to the maximum measurable temperature in principle. For high temperatures above 1800°C, non-contact temperature measurement methods are mainly used. With the development of infrared technology, radiation temperature measurement has gradually expanded from visible light to infrared and has been used below 700°C to room temperature with high resolution. Working principle Metals undergo a corresponding extension when the ambient temperature changes, so the sensor can signal this response in different ways. Bimetal Sensor A bimetal sheet is composed of two pieces of metal with different expansion coefficients attached. As the temperature changes, material A expands more than the other metal, causing the metal sheet to bend. The curvature of the bend can be converted into an output signal. Bimetal Rod and Tube Sensors As the temperature increases, the length of the metal tube (material A) increases, while the length of the non-expanding steel rod (metal B) does not increase so that the linear expansion of the metal tube can be transmitted due to the change of position. In turn, this linear expansion can be translated into an output signal. Deformation Curve Design Sensors for Liquids and Gases When the temperature changes, liquids, and gases will also produce corresponding changes in volume. Various types of structures can convert this change in expansion into a change in position, thus producing a position change output (potentiometer, sense bias, baffle, etc.). Resistance sensing As the temperature of the metal changes, its resistance value also changes. For different metals, every time the temperature changes by one degree, the resistance value changes differently, and the resistance value can be directly used as an output signal. There are two types of changes in resistance positive temperature coefficient Increased temperature = increased resistance A decrease in temperature = a decrease in resistance negative temperature coefficient Increased temperature = decreased resistance Decrease in temperature = increase in resistance Thermocouple Sensing A thermocouple consists of two metal wires of different materials welded together at the ends. Then measure the ambient temperature of the non-heating part, and the temperature of the heating point can be accurately known. Since it must have two conductors of different materials, it is called a thermocouple. Thermocouples made of different materials are used in different temperature ranges, and their sensitivities also vary. The sensitivity of the thermocouple refers to the change in the output potential difference when the temperature of the heating point changes by 1 °C. For most thermocouples supported by metallic materials, this value is between 5 and 40 microvolts/°C. Since the sensitivity of the thermocouple temperature sensor has nothing to do with the thickness of the material, it can also be made into a temperature sensor with very thin materials. Also due to the good ductility of the metal material used to make thermocouples, this tiny temperature-measuring element has a very high response speed and can measure rapidly changing processes. Selection method If you want to make reliable temperature measurements, you first need to choose the correct temperature instrument, that is, the temperature sensor. Among them, thermocouples, thermistors, platinum resistance thermometers (RTDs), and temperature ICs are the most commonly used temperature sensors in testing. The following is an introduction to the characteristics of the thermocouple and thermistor temperature instruments. thermocouple Thermocouples are the most commonly used temperature sensors in temperature measurement. Its main advantages are a wide temperature range and adaptability to various atmospheric environments, and it is strong, low in price, does not require a power supply, and is the cheapest. A thermocouple consists of two wires of dissimilar metals (metal A and metal B) connected at one end. When one end of the thermocouple is heated, there is a potential difference in the thermocouple circuit. The temperature can be calculated from the measured potential difference. However, there is a nonlinear relationship between voltage and temperature. Since the temperature is a nonlinear relationship between voltage and temperature, it is necessary to make a second measurement for the reference temperature (Tref), and use the test equipment software or hardware to process the voltage-temperature conversion inside the instrument, to Finally the thermocouple temperature (Tx), is obtained. Both Agilent34970A and 34980A data collectors have built-in measurement computing capabilities. In short, thermocouples are the simplest and most versatile temperature sensors, but thermocouples are not suitable for high-precision measurements and applications. Thermistors are made of semiconductor materials, and most of them have a negative temperature coefficient, that is, the resistance value decreases with the increase in temperature. Temperature changes will cause large resistance changes, so it is the most sensitive temperature sensor. However, the linearity of the thermistor is extremely poor and has a lot to do with the production process. 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